OSP: OSP is a process of copper foil surface treatment of printed circuit board (PCB), which meets the requirements of RoHS directive. OSP is the abbreviation of organic solderability preservation, which is translated into organic solder film in Chinese, also known as copper protective agent, and also known as preflux in English. In short, OSP is to grow an organic film on a clean bare copper surface by chemical method. This film has anti-oxidation, heat shock resistance and moisture resistance to protect the copper surface from further rusting (oxidation or vulcanization, etc.) in the normal environment; However, in the subsequent welding high temperature, the protective film must be easily and quickly removed by the flux, so that the exposed clean copper surface can be immediately combined with the molten solder to form a solid solder joint in a very short time

PCB Standard: IPC-A-610 D

Product Description
Our Double Side PCB has high-quality raw materials, advanced production equipment, rich production experience, and strict quality control. 

1: Support 48 hours make the sample, In general, smaples need 3-5 working days, mass production need 8-12 working days.
2. MOQ is 1 PCS. produce rigid FR4,1-48 layer PCB.
3. Mini Line width / space:0.15mm, Minin drill holes:0.3mm
4. Pass through ISO9001/SGS/ROHS certificate
5. Support OEM design, Send us gerber file.

Supply Ability
Supply Ability: 400000 Piece/Pieces per month
Packaging & Delivery
Packaging Details
PCB: Vacuum Packing with Carton Box 
PCBA: ESD Packing with Carton Box
Shipping sevice: By EMS/DHL/FEDEX/UPS/SEA
Port: ShangHai  
Payment Method : T/T; Paypal; Western Union; MoneyGram
Prdocut cost :  0.1 USD-8 USD

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